By Dr Phil Garrou, Contributing Editor EVG Licenses IBM Laser deBonding Tech IBM’s Hybrid Laser Release Process has been licensed by EV Group for inclusion in their low-temperature laser debonding equipment ()The IBM technology will reportedly help EVG address the industry’s requirements for temporary bonding and debonding, including high throughput, low wafer stress for high yield, and .
Here, the process steps involve first creating the RDL on a carrier wafer, chip-attaching the top-die (CoW), molding & singulation In either case, generating the RDL requires expensive fab/foundry (BEOL) class equipment that may not be readiy available at ,
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EV Group, IBM Agree to License Laser Debonding Tech - News
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Medium Frequency Furnace Equipment Medium frequency furnace equipment is used for iron, steel and non ferrous metals Induction melting offers the modern foundry a clean, efficient, cost-effective melting system with all the advantages of state-of-the-art technology and environmental protection
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EVG And NSI Collaborate On GaAs On Silicon Integration
EV Group, a supplier of wafer bonding and lithography equipment, has announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry's first process technology platform for wafer-level heterogeneous integration of GaAs on silicon for use in RF front-end module (FEM .
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SUSS MicroTec's MA300 Gen2 is a highly automated mask aligner platform for 300mm and 200mm wafers It is specifically designed for 3D Packaging, wafer level packaging and flip-chip applications but can be used as well for other technologies where geometries in the range of 3 ,
Mar 31, 2016· HC Starck of Newton, Mass is the newest member of CHTEHC Starck is a leading global supplier of technology metals, with production facilities in Europe, North America and Asia The company supplies fabricated products to OEMs, end-users, and aftermarket furnace manufacturers for heat treating medical, aerospace, defense, automotive, energy, nuclear fuel, crystal growth and waste .
EV Group Partners with NSI to Enable First Wafer-Level ,
Mar 20, 2019· SEMICON China, March 20, 2019 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry's first process technology platform for wafer-level heterogeneous ,
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The degree of difficulty of doing this "sand core debonding" depends upon the geometry of the part being cast There are a number of binder systems used for the bonding of foundry sand into sand molds and sand cores, the major ones being identified in the trades by the following nomenclature: Furna No-Bake Phenolic Urethane Cold Box
Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer-, temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets
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The equipment and process technology supplier’s foundry customers are seeing a need to move to 3D transistor architectures with minimal leakage, she said, because of those power requirements Development will continue at 20nm and 16nm as well at TSMC and its rivals
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EVG partners with NSI on wafer-level heterogeneous ,
Mar 20, 2019· EV Group of St Florian, Austria – a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications – has partnered with Chinese specialty foundry Ningbo Semiconductor ,
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EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo, China, in the development of the industry’s first process technology platform for wafer-level heterogeneous integration of gallium arsenide (GaAs) on silicon for use .
Kingyoup And IBM Develop Wafer Bonding & Debonding Tool
The temporary bonding and debonding equipment uses a hybrid laser debonding solution with an throughput of over 60 to 100 wafers per hour It also supports wafer thinning to less than a human hair thickness (less than 50 microns) for either 200mm or 300mm wafers
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However as with other fab tools, bonding and debonding equipment vendors have added multiple chambers to tools to improve throughput (as well as accommodating various and differing bonding and debonding process flows) Austria-based EV Group, for example, unveiled its EVG850 temporary bonding and debonding (TB/DB) tool last year
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